About this scholarly article

SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Comparison of experimental and theoretical curvature considerations for direct wafer bonding by Hong, Linh; Bower, Robert W.; Swee, Yong Khim; Zheng, HongYu; Chen, Ray T. is a scholarly article available to read on EtoBox.

Author

Hong, Linh; Bower, Robert W.; Swee, Yong Khim; Zheng, HongYu; Chen, Ray T.

Publisher

SPIE

Published

1997