About this scholarly article

AIP Conference Proceedings [AIP Publishing LLC 4TH INTERNATIONAL CONGRESS IN ADVANCES IN APPLIED PHYSICS AND MATERIALS SCIENCE (APMAS 2014) - Fethiye, Turkey (24–27 April 2014)] - Surface and subsurface cracks characteristics of single crystal SiC wafer in surface machining by Qiusheng, Y.; Senkai, C.; Jisheng, P. is a scholarly article available to read on EtoBox.

Author

Qiusheng, Y.; Senkai, C.; Jisheng, P.

Publisher

AIP Publishing LLC

Published

2015

Language

EN