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About this Engineering article
Rapid Low-Temperature 3D Integration of Silicon Nanowires on Flexible Substrates by Kim, Yoonkap; Kim, Han-Jung; Kim, Jae-Hyun; Choi, Dae-Geun; Choi, Jun-Hyuk; Jung, Joo-Yun; Jeon, Sohee; Lee, Eung-Sug; Jeong, Jun-Ho; Lee, Jihye is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Kim, Yoonkap; Kim, Han-Jung; Kim, Jae-Hyun; Choi, Dae-Geun; Choi, Jun-Hyuk; Jung, Joo-Yun; Jeon, Sohee; Lee, Eung-Sug; Jeong, Jun-Ho; Lee, Jihye
- Publisher
- John Wiley and Sons; Wiley (John Wiley & Sons); Wiley - V C H Verlag GmbbH & Co.; Publons; Wiley (ISSN 1613-6810)
- Published
- 2015
- Language
- EN
- Field
- Engineering (Physical Sciences)