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About this Engineering article

Thermal evaluation of a PowerPC 6201 microprocessor in a multiprocessor computer by H. Wong; T. Lee is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
H. Wong; T. Lee
Publisher
IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1070-9886)
Published
1996
Language
EN
Field
Engineering (Physical Sciences)

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