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About this scholarly article
2005 7th Electronic Packaging Technology Conference - Bend Fatigue Reliability Test and Analysis for Pb-free Solder Joint by Fa-Xing Che, ; Pang, H.L.J.; Chong, D.Y.R.; Low, P.T.H. is a scholarly article available to read on EtoBox.
- Author
- Fa-Xing Che, ; Pang, H.L.J.; Chong, D.Y.R.; Low, P.T.H.
- Publisher
- IEEE
- Published
- 2005
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