About this scholarly article

2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) - AFM Surface Roughness and Depth Measurement of Trenches with High Aspect Ratio by Heider, Franz; Schwarzfurtner, Helfried; Lugger, Mario; Cho, Sang-Joon; Trenkler, Thomas is a scholarly article available to read on EtoBox.

Author

Heider, Franz; Schwarzfurtner, Helfried; Lugger, Mario; Cho, Sang-Joon; Trenkler, Thomas

Publisher

IEEE

Published

2019

Language

EN