About this scholarly article

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - FIB & TEM application methods with related theory explanations by Xie, Lingzhi; Zheng, Sunday; Lee, J. H.; Li, Ming; Zhang, Mark; Chien, Kary is a scholarly article available to read on EtoBox.

Author

Xie, Lingzhi; Zheng, Sunday; Lee, J. H.; Li, Ming; Zhang, Mark; Chien, Kary

Publisher

IEEE

Published

2017

Language

EN