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About this Materials Science article
Effect of strain rate on interfacial fracture behaviors of Sn-58Bi/Cu solder joints by Hu, Xiaowu; Yu, Xiao; Li, Yulong; Huang, Qiang; Liu, Yi; Min, Zhixian is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Hu, Xiaowu; Yu, Xiao; Li, Yulong; Huang, Qiang; Liu, Yi; Min, Zhixian
- Publisher
- Springer US; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC; Society for Mining, Metallurgy and Exploration Inc. (ISSN 0957-4522)
- Published
- 2014
- Language
- EN
- Field
- Materials Science (Physical Sciences)
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