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Chemical vapor deposition (CVD) and physical vapor deposition (PVD) are thin film deposition techniques. CVD involves introducing gases into a deposition reactor where they react and form a thin film on a substrate. PVD deposits thin films by condensing a vaporized material onto a surface, such as by evaporation or sputtering. Common CVD methods include atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), plasma enhanced CVD (PECVD), and metal organic CVD (MOCVD). [/SUMMARY]

Author
dilaawaiz
Language
EN