About this scholarly article

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Recovering contacting interfaces in packaging and in semiconductor devices: Mechanisms and how to handle them in analysis by Jacob, Peter; Pecnik, Christina; Nicoletti, Giovanni; Broennimann, Rolf is a scholarly article available to read on EtoBox.

Author

Jacob, Peter; Pecnik, Christina; Nicoletti, Giovanni; Broennimann, Rolf

Publisher

IEEE

Published

2016