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About this Engineering article
Experimental Investigation on the Height Deviation of Bumps Printed by Solder Jet Technology by Xiong, Wei; Qi, Lehua; Luo, Jun; Zhang, Daicong; Liang, Junhao; Yi, Hao is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Xiong, Wei; Qi, Lehua; Luo, Jun; Zhang, Daicong; Liang, Junhao; Yi, Hao
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0924-0136)
- Published
- 2017
- Language
- EN
- Field
- Engineering (Physical Sciences)
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