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About this Engineering article
Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150 °C by Pei Yao; Ping Liu; Jim Liu is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Pei Yao; Ping Liu; Jim Liu
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-9317)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)