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What is FR4 PCB Laminate Material Properties about?

This document characterizes the material properties of two FR4 printed circuit board laminates before and after exposure to typical soldering conditions. Dynamic mechanical analysis was used to measure the storage and loss modulus, glass transition temperature, and coefficient of thermal expansion of the laminates. Flexural strength was also tested, and thermal stability was analyzed. The results provide detailed material properties for the laminates and insight into how soldering exposure can affect proper

Author

عثمان أمنيسي

Language

EN