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About this Engineering article

Prediction of Chip Solder Fatigue in IGBTs by Wang, Xiping; Li, Zhigang; Yao, Fang; Tang, Shengxue is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Wang, Xiping; Li, Zhigang; Yao, Fang; Tang, Shengxue
Publisher
John Wiley and Sons; Wiley (John Wiley & Sons); John Wiley & Sons Inc.; Wiley (ISSN 1931-4973)
Published
2020
Language
EN
Field
Engineering (Physical Sciences)