About this scholarly article

Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - A comparison of via overetch variations between conventional Al-W and dual-inlaid copper integrations by Smith, B.; Blackley, S.; Carter, R.; Chheda, S.; Crabtree, P.; Farber, D.; Gall, M.; Islam, R.; Jawarani, D.; King, C.; Menke, D.; Nelson, R.; Pressley, L.; Smith, D.; Sparks, T.; Stephens, T.; Travis, E.; Venkatesan, S. is a scholarly article available to read on EtoBox.

Author

Smith, B.; Blackley, S.; Carter, R.; Chheda, S.; Crabtree, P.; Farber, D.; Gall, M.; Islam, R.; Jawarani, D.; King, C.; Menke, D.; Nelson, R.; Pressley, L.; Smith, D.; Sparks, T.; Stephens, T.; Travis, E.; Venkatesan, S.

Publisher

IEEE

Published

1999

Language

EN