About this scholarly article

2008 58th Electronic Components and Technology Conference - Reliability of high I/O count wafer level packages by Zbrzezny, Adam R.; Mclellan, Neil; Lee, Yeong J. is a scholarly article available to read on EtoBox.

Author

Zbrzezny, Adam R.; Mclellan, Neil; Lee, Yeong J.

Publisher

IEEE

Published

2008