About this scholarly article

40th Conference Proceedings on Electronic Components and Technology - Extremely reliable bonding of large silicon dice using gold-tin alloy by Matijasevic, G.S.; Wang, C.Y.; Lee, C.C. is a scholarly article available to read on EtoBox.

Author

Matijasevic, G.S.; Wang, C.Y.; Lee, C.C.

Publisher

IEEE

Published

1990

Language

EN