About this scholarly article

IEEE International Integrated Reliability Workshop Final Report, 2003 - Reliability of dielectric barriers in copper damascene applications by Lee, A.S.; Lakshmanan, A.; Rajagopalan, N.; Zhenjiang Cui, ; Le, M.; Li Qun Xia, ; Bok Heon Kim, ; Hichem M'Saad, is a scholarly article available to read on EtoBox.

Author

Lee, A.S.; Lakshmanan, A.; Rajagopalan, N.; Zhenjiang Cui, ; Le, M.; Li Qun Xia, ; Bok Heon Kim, ; Hichem M'Saad,

Publisher

IEEE

Published

2003

Language

EN