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Area Array Package Design : Techniques in High-density Electronics by KEN GILLEO,PH.D. is a book available to read on EtoBox.

What is Area Array Package Design : Techniques in High-density Electronics about?

This comprehensive tutorial on area array package design features the most important new techniques, clearly explained by a team of world-class professionals and researchers. Area Array Package Design provides hands-on expertise and leading-edge information on flip chip, BGA, and MEMs methods.* Expert design information that can save days of searching* New 3D approaches* Solutions to MEMS challenges* Coverage of economic, environmental, standards compliance, failure analysis, and other essential considerations* Technology history and background*90 illustrations clarifying key conceptsFrom the editor of Area Array Packaging Handbook: Manufacturing and Assembly; Handbook of Flexible Circuits; and Polymer Thick Film The ideal electronic package is an economical and manufacturable electromechanical platform for one or more electronic devices that affords protection, facilitates handling, and provides the geometric translations and compatible interface required for connection to the next system level by practical assembly processes. Covers the important techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, this book

Author

KEN GILLEO,PH.D.

Publisher

MCGRAW HILL

Published

2004

Language

EN

ISBN

9780071428279

Subjects

Engineering, Mathematics, Technology