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About this Engineering article
Analysis of Thermal Residual Stress/Strain in REBCO Coated Conductor Tapes by Dizon, John Ryan C.; Nisay, Arman Ray N.; Dedicatoria, Marlon James A.; Munoz, Rodrigo C.; Hyung-Seop Shin, ; Sang-Soo Oh, is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Dizon, John Ryan C.; Nisay, Arman Ray N.; Dedicatoria, Marlon James A.; Munoz, Rodrigo C.; Hyung-Seop Shin, ; Sang-Soo Oh,
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1051-8223)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)