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Reliability Model for SAC Solder Cycling by malk10 is a document available to read on EtoBox.
What is Reliability Model for SAC Solder Cycling about?
This paper introduces a novel reliability model for SAC solder interconnects, addressing limitations of energy-based methodologies in predicting failure during isothermal and thermal cycling. The model incorporates stress, strain, strain rate, and temperature to accurately predict material behavior under cyclic loading, demonstrating superior predictive capabilities compared to existing models. Experimental results from isothermal mechanical cycling tests validate the model
- Author
- malk10
- Language
- EN