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About this Engineering article
Effect of cooling rate on structure and creep behavior of Sn-0.7Cu-0.5Zn lead-free solder alloy by Gouda, E. S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Gouda, E. S.
- Publisher
- EDP Sciences (ISSN 1286-0042)
- Published
- 2009
- Language
- EN
- Field
- Engineering (Physical Sciences)