Opening book details…
About this scholarly article
2016 6th Electronic System-Integration Technology Conference (ESTC) - Mechanical behaviour and delamination mechanisms in temporary bonding by Abadie, Karine; Fournel, Frank; Montmeat, Pierre; Wimplinger, Markus is a scholarly article available to read on EtoBox.
- Author
- Abadie, Karine; Fournel, Frank; Montmeat, Pierre; Wimplinger, Markus
- Publisher
- IEEE
- Published
- 2016
- Language
- EN
More by Abadie, Karine; Fournel, Frank; Montmeat, Pierre; Wimplinger, Markus
Browse all works by Abadie, Karine; Fournel, Frank; Montmeat, Pierre; Wimplinger, Markus