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About this Engineering article
Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process by Viet H. Nguyen; Roel Daamen; Romano Hoofman is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Viet H. Nguyen; Roel Daamen; Romano Hoofman
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-9317)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)
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