About this scholarly article

2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Achievement of low temperature chip stacking by a wafer-applied underfill material by Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Jing-Yao; Hung, Yin-Po; Yang, Tsung-Fu; Huang, Yu-Wei; Chen, Su-Mei; Chang, Tao-Chih; Huang, Qiaohong; Guino, Rose; Hoang, Gina; Bai, Jie; Becker, Kevin is a scholarly article available to read on EtoBox.

Author

Cheng, Ren-Shin; Kao, Kuo-Shu; Chang, Jing-Yao; Hung, Yin-Po; Yang, Tsung-Fu; Huang, Yu-Wei; Chen, Su-Mei; Chang, Tao-Chih; Huang, Qiaohong; Guino, Rose; Hoang, Gina; Bai, Jie; Becker, Kevin

Publisher

IEEE

Published

2011

Language

EN