Opening book details…
About this Engineering article
Fabrication Technologies for Package Parts of Josephson Chips by OOHIRA, Fumikazu; KOYABU, Kunio; AOKI, Katuhiko; FUJIWARA, Kouiti is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- OOHIRA, Fumikazu; KOYABU, Kunio; AOKI, Katuhiko; FUJIWARA, Kouiti
- Publisher
- Japanese Society for Precision Engineering; The Japan Society for Precision Engineering; Seimitsu Kogakkai/The Japan Society for Precision Engineering; Japan Society for Precision Engineering (ISSN 0912-0289)
- Published
- 1987
- Language
- EN
- Field
- Engineering (Physical Sciences)
More by OOHIRA, Fumikazu; KOYABU, Kunio; AOKI, Katuhiko; FUJIWARA, Kouiti
Browse all works by OOHIRA, Fumikazu; KOYABU, Kunio; AOKI, Katuhiko; FUJIWARA, Kouiti