About this scholarly article

Volume 10: Micro- and Nano-Systems Engineering and Packaging - Thermal Analysis of a Laser Peeling Technique for Removing Micro Edge Cracks of Ultrathin Glass Substrates for Web Processing by Yang, Tian-Shiang; Chen, Guang-Di; Chen, Kuo-Shen; Hong, Rong-Can; Chiu, Tz-Cheng; Wen, Chang-Da; Li, Chun-Han; Huang, Chien-Jung; Chen, Kun-Tso; Lin, Mao-Chi is a scholarly article available to read on EtoBox.

Author

Yang, Tian-Shiang; Chen, Guang-Di; Chen, Kuo-Shen; Hong, Rong-Can; Chiu, Tz-Cheng; Wen, Chang-Da; Li, Chun-Han; Huang, Chien-Jung; Chen, Kun-Tso; Lin, Mao-Chi

Publisher

American Society of Mechanical Engineers

Published

2015

Language

EN