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This document discusses characterization of molded underfill material for flip chip ball grid array packages. It summarizes that molded underfill provides benefits over conventional underfill, such as a simplified one-step process, higher throughput, and lower cost. The document then analyzes material properties of molded underfill using techniques like DSC, TGA, TMA and DMA to evaluate curing conditions, coefficient of thermal expansion, glass transition temperature, storage modulus, and weight loss. Resul

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