About this scholarly article

2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Laser bonding system for semiconductor device and MEMS encapsulation by Huang, Yuanhao; Li, Maoyu; Lai, Yuneng; Chen, Zunmiao; Zhang, Jianhua is a scholarly article available to read on EtoBox.

Author

Huang, Yuanhao; Li, Maoyu; Lai, Yuneng; Chen, Zunmiao; Zhang, Jianhua

Publisher

IEEE

Published

2011