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About this Engineering article
Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink by Dang, B.; Bakir, M.S.; Meindl, J.D. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Dang, B.; Bakir, M.S.; Meindl, J.D.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0741-3106)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)