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About this Engineering article
Preparation of SiC/SiO2 Hard Core–Soft Shell Abrasive and Its CMP Behavior on Sapphire Substrate by Dai, Sanwei; Lei, Hong; Fu, Jifang is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Dai, Sanwei; Lei, Hong; Fu, Jifang
- Publisher
- Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
- Published
- 2019
- Language
- EN
- Field
- Engineering (Physical Sciences)