About this scholarly article

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Failure analysis of 200 nm-thick gold interconnects induced by alternating current by Zhang, G. P.; Wang, M.; Zhang, B. is a scholarly article available to read on EtoBox.

Author

Zhang, G. P.; Wang, M.; Zhang, B.

Publisher

IEEE

Published

2009

Language

EN