About this scholarly article

2017 IEEE International Workshop On Integrated Power Packaging (IWIPP) - Improved high-temperature dielectric property of epoxy resin composites with nano- and micro-sized magnesia fillers by Xie, Q.; Ohki, Y.; Hirai, N.; Cheng, Y-H is a scholarly article available to read on EtoBox.

Author

Xie, Q.; Ohki, Y.; Hirai, N.; Cheng, Y-H

Publisher

IEEE

Published

2017