About this scholarly article

2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Temporary wafer bonding and debonding by an electrochemically active polymer adhesive for 3D integration by Gatty, Hithesh K; Niklaus, Frank; Stemme, Goran; Roxhed, Niclas is a scholarly article available to read on EtoBox.

Author

Gatty, Hithesh K; Niklaus, Frank; Stemme, Goran; Roxhed, Niclas

Publisher

IEEE

Published

2013

Language

EN