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Can I read SLA printing of POSS-containing, bio-based composites with low dielectric constant and shape-memory function on EtoBox?

SLA printing of POSS-containing, bio-based composites with low dielectric constant and shape-memory function by Zhendong Hu; Mengting Liu; Junbo Che; Qi Kang; Ziyi Liu; Zhe Qiang; Xueqing Liu; Yumin Xia; Shuohan Huang; Jianming Zhang; Yuwei Chen is a Materials Science article available to read on EtoBox.

What is SLA printing of POSS-containing, bio-based composites with low dielectric constant and shape-memory function about?

Improving sustainability and functionality of resins is important for the development of 3D printing technologies. This work demonstrates a novel bio-based and low dielectric resin containing polyhedral oligomeric silsesquioxane (POSS) for stereolithography (SLA) printing to fabricate sensors and shape memory materials with complex geometry. Epoxidized soybean oil (ESO) and methacrylic acid are used to synthesize a biobased methacrylate resin (MESO) via a ring-opening reaction, followed by incorporation of POSS into polymer matrix. In general, the viscosity of POSS/MESO composite resins is in the range of 0.40–0.58 Pa s, making them viable for SLA printing designs. With the addition of 5 wt% POSS, POSS/MESO composites can exhibit excellent mechanical properties, including tensile strength (18.9 MPa), elongation at break (19.8%), and toughness (399.2 MJ/m3). Furthermore, these materials have a very low dielectric constant of 2.97 at 1 MHz, which is desired for microelectronic applications to overcome signal delay and energy loss. In addition, presence of permanent and reversible networks formed by MESO and POSS endows the POSS/MESO composites with good shape memory property. The app

Who reads SLA printing of POSS-containing, bio-based composites with low dielectric constant and shape-memory function?

It is typically read by researchers, students, and practitioners in Materials Science.

Author
Zhendong Hu; Mengting Liu; Junbo Che; Qi Kang; Ziyi Liu; Zhe Qiang; Xueqing Liu; Yumin Xia; Shuohan Huang; Jianming Zhang; Yuwei Chen
Publisher
Elsevier BV
Published
2023
Language
EN
Field
Materials Science (Physical Sciences)

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