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About this Materials Science article
DO22–(Cu,Ni)3Sn intermetallic compound nanolayer formed in Cu/Sn-nanolayer/Ni structures by Lilin Liu; Haiyou Huang; Ran Fu; Deming Liu; Tong-Yi Zhang is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Lilin Liu; Haiyou Huang; Ran Fu; Deming Liu; Tong-Yi Zhang
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2009
- Language
- EN
- Field
- Materials Science (Physical Sciences)
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