About this scholarly article

Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium - Processing, transfer solder bumping, chip attachment and testing of a thin film Cu/Photo-BCB MCM-D by Ida, Y.; Garrou, P.E.; Strandjord, A.J.G.; Cummings, S.L.; Boyd Rogers, W.; Berry, M.J.; Kisting, S.R. is a scholarly article available to read on EtoBox.

Author

Ida, Y.; Garrou, P.E.; Strandjord, A.J.G.; Cummings, S.L.; Boyd Rogers, W.; Berry, M.J.; Kisting, S.R.

Publisher

IEEE

Published

1996

Language

EN