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About this Engineering article
An evaluation method for deposited thin film interfacial interconnexions : M. Yang and B. G. Bender, Proc. 1966 Electron. Components Conf., Washington D.C., p. 149 is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1967
- Field
- Engineering (Physical Sciences)