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About this Engineering article
Electrical characterization of packages for high-speed integrated circuits : Christopher J. Stanghan and Brian M. Macdonald. IEEE Trans. Compon. Hybrids mfg Technol.CHMT-8 (4), 468 (1985) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1987
- Field
- Engineering (Physical Sciences)