About this scholarly article

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Innovative packaging concepts for ultra thin integrated circuits by Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H. is a scholarly article available to read on EtoBox.

Author

Klink, G.; Feil, M.; Ansorge, F.; Aschenbrenner, R.; Reichl, H.

Publisher

IEEE

Published

2001

Language

EN