About this scholarly article

2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Effect of Chip Layout in Wafer on Molding and Fan-Out Wafer Level Packaging (FO-WLP) Technology by Li, Yang; Ming, Xuefei; Ji, Yong; Wu, Xin; Gao, Nayan; Wang, Bo is a scholarly article available to read on EtoBox.

Author

Li, Yang; Ming, Xuefei; Ji, Yong; Wu, Xin; Gao, Nayan; Wang, Bo

Publisher

IEEE

Published

2018

Language

EN