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Can I read X-ray microbeam strain investigation on Cu–MEMS structures on EtoBox?
X-ray microbeam strain investigation on Cu–MEMS structures by Olivier Perroud; Renaud Vayrette; Christian Rivero; Olivier Thomas; Jean-Sébastien Micha; Olivier Ulrich is a Engineering article available to read on EtoBox.
What is X-ray microbeam strain investigation on Cu–MEMS structures about?
The mechanical properties of simple metals in small dimensions have been the objects of many studies. Average stress measurements clearly show that yield stress increases significantly when the size decreases but local strain measurements indicate considerable grain-to-grain and intra-grain strain variations. The link between the macroscopic behaviour of microstructures and the corresponding local processes is still difficult to analyse. Copper is used in advanced microelectronic interconnects and the mechanical properties of narrow interconnects is a key issue for the reliability of devices. Average strain measurements performed on line arrays show a drastically different behaviour in narrow lines as compared with wide lines. ST microelectronics in Rousset developed a MEMS sensor integrated in the damascene process to follow the stress after processing. This microsystem can be a very efficient tool to monitor the average stress in interconnects on the chip. The gradient of strain in interconnects may lead to failures from void and hillocks and local stress repartition can be obtained through X-ray microdiffraction. Laue microdiffration is a unique non-destructive method to investi
Who reads X-ray microbeam strain investigation on Cu–MEMS structures?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Olivier Perroud; Renaud Vayrette; Christian Rivero; Olivier Thomas; Jean-Sébastien Micha; Olivier Ulrich
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0167-9317)
- Published
- 2010
- Language
- EN
- Field
- Engineering (Physical Sciences)