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About this Engineering article
Impact of Substrate Thickness on the Degradation in Multicrystalline Silicon by Varshney, Utkarshaa; Kim, Moonyong; Khan, Muhammad Umair; Hamer, Phillip; Chan, Catherine; Abbott, Malcolm; Hoex, Bram is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Varshney, Utkarshaa; Kim, Moonyong; Khan, Muhammad Umair; Hamer, Phillip; Chan, Catherine; Abbott, Malcolm; Hoex, Bram
- Publisher
- Institute of Electrical and Electronics Engineers; IEEE Electron Devices Society; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3381)
- Published
- 2021
- Field
- Engineering (Physical Sciences)