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About this Engineering article
Deep-Trench Etching for Chip-to-Chip Three-Dimensional Integration Technology by H. Kikuchi; Y. Yamada; H. Kijima; T. Fukushima; M. Koyanagi is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- H. Kikuchi; Y. Yamada; H. Kijima; T. Fukushima; M. Koyanagi
- Publisher
- Institute of Pure and Applied Physics; Japan Society of Applied Physics; IOP Publishing (ISSN 0021-4922)
- Published
- 2006
- Language
- EN
- Field
- Engineering (Physical Sciences)