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This study presents a novel liquid crystalline epoxy composite enhanced with a hybrid filler of nano-diamond and modified alumina, achieving significant improvements in thermal conductivity (0.99 W/m⋅K) and dielectric breakdown strength (75.2 kV/mm) compared to traditional materials. The research addresses the challenge of balancing thermal conductivity and electrical insulation properties in packaging materials for power devices. The findings suggest that the optimized hybrid fillers can lead to the develo
- Author
- mahmoud ali
- Language
- EN