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Advances in MM-Wave Packaging Techniques by Tribu Vaquero Jimenez is a document available to read on EtoBox.
What is Advances in MM-Wave Packaging Techniques about?
This document discusses packaging technologies for millimeter-wave integrated circuits (MMICs). It begins by describing the challenges of packaging MMICs above 45 GHz due to bondwire inductance. It then summarizes several approaches that can enable packaging above 45 GHz, including: 1) Packages with waveguide apertures that integrate waveguide-to-microstrip transitions, 2) Packages with integral antennas that integrate antennas directly onto the package, and 3) Micro-coax based packaging that replaces bondw
- Author
- Tribu Vaquero Jimenez
- Language
- EN