About this scholarly article

2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs by Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Kim, Joungho is a scholarly article available to read on EtoBox.

Author

Cho, Kyungjun; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Kim, Seongguk; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Kim, Joungho

Publisher

IEEE

Published

2019