About this scholarly article

SPIE Proceedings [SPIE MOEMS-MEMS 2008 Micro and Nanofabrication - San Jose, CA (Saturday 19 January 2008)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII - Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs by Garcia-Blanco, S.; Topart, P.; Desroches, Y.; Caron, J.S.; Williamson, F.; Alain, C.; Jerominek, H.; Hartzell, Allyson L.; Ramesham, Rajeshuni is a scholarly article available to read on EtoBox.

Author

Garcia-Blanco, S.; Topart, P.; Desroches, Y.; Caron, J.S.; Williamson, F.; Alain, C.; Jerominek, H.; Hartzell, Allyson L.; Ramesham, Rajeshuni

Publisher

SPIE

Published

2008

Language

EN