About this scholarly article

2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Study on the failure behavior of BGA solder interconnections under fatigue loading by Xu, Xing; Chen, Gaiqing; Cheng, Mingsheng is a scholarly article available to read on EtoBox.

Author

Xu, Xing; Chen, Gaiqing; Cheng, Mingsheng

Publisher

IEEE

Published

2015