About this scholarly article

1996 Proceedings 46th Electronic Components and Technology Conference - Foil covered PACkage (FPAC): a new package concept by Hotta, Y.; Sigyo, H.; Kondo, S.; Oizumi, S. is a scholarly article available to read on EtoBox.

Author

Hotta, Y.; Sigyo, H.; Kondo, S.; Oizumi, S.

Publisher

IEEE

Published

1996